Summary

The Okamoto VG-202MKII is designed for super precision grinding of silicon-on-insulator (SOI) wafers. It performs high-accuracy material removal to achieve tight geometric and surface finish specifications for advanced wafer processing. The system is intended for applications requiring superior flatness and surface quality on SOI substrates.

Key Capabilities

• Super precision grinding of SOI wafers
• Supports production of tight geometric tolerances and fine surface finishes

Key Specifications

| Parameter | Value | Unit |