Summary

The Okamoto GNX200B is a fully-automatic wafer grinding machine designed for continuous downfeed material removal. Its core function is to refine and thin wafers, supporting semiconductor manufacturing workflows. Integrated robotic wafer handling and post-grind cleaning stations distinguish this system for high-throughput, unattended operation.

Key Capabilities

• Continuous downfeed grinding process for wafer thinning
• Fully-automatic operation with robotic wafer handling
• Dual wafer cleaning stations for post-grind cleaning
• Automated load and unload arms for wafer transfer

Key Specifications

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