Summary

The Okamoto GDM300 is designed for wafer thinning in semiconductor production, combining fully-automatic grinding with in-line dual polishing capability. It supports wafer thinning down to 25 µm and offers optional integrated edge-grinding and non-contact laser thickness detection. The system can be directly docked to a Detaper/Mounter unit for streamlined process integration.

Key Capabilities

• Fully-automatic wafer grinding and dual in-line polishing for wafer thinning
• Supports wafer thinning down to 25 µm
• Optional integrated edge-grinding capability
• Optional non-contact laser thickness detection
• Docking interface for direct connection to Detaper/Mounter unit

Key Specifications