Summary

The Okamoto VG-401H is a semi-automatic wafer grinder engineered for hard materials, providing precision grinding for substrates such as AlTic, SiC, glass, and ceramics. Its design includes in-process wheel dressing and a high-power 11 kW (14.75 hp) motor to support demanding wafer thinning and finishing applications. The machine incorporates a reinforced column structure for increased grinding stability.

Key Capabilities

• Semi-automatic grinding of hard materials (AlTic, SiC, glass, ceramics)
• In-process wheel dressing system
• Rigid column construction for enhanced stability
• 11 kW (14.75 hp) high-power grinding spindle

Key Specifications