Okamoto GNX300B | Fully-automatic Wafer GrinderAvailable
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Okamoto
To be updated
Condition: New
Scale: Production
Status: Ready-to-Ship
Ships From: USA
Product Description
Summary
The Okamoto GNX300B is a fully-automatic wafer grinder designed for down-feed grinding of semiconductor wafers. This machine enables precise material removal with integrated robotic wafer handling, supporting automated production environments. The model accommodates both 8-inch and 12-inch wafer sizes.
Key Capabilities
- Down-feed grinding of semiconductor wafers
- Fully-automatic operation with robotic wafer handling
- Compatible with 8-inch and 12-inch wafers
Key Specifications
| Parameter | Value | Unit |
|---|---|---|
| Wafer size support | 8 and 12 | inch |