Summary

The Okamoto PNX332B is a fully-automatic polishing machine engineered for final and reclaim processing of 8-inch and 12-inch wafers. Its core function is precision surface finishing of semiconductor wafers, supporting both new and reclaimed wafer manufacturers. The system delivers automated operation for consistent polishing in high-throughput environments.

Key Capabilities

• Automatic polishing process for 8" and 12" diameter semiconductor wafers
• Supports both final wafer finishing and wafer reclaim applications

Key Specifications