Summary

The Okamoto SPP-600S/800S is a semi-automatic system engineered for chemical mechanical planarization of semiconductor wafers. Its core function is surface planarization, targeting applications that require controlled wafer flatness via chemical and mechanical action. Key characteristics include semi-automated operation and dedicated integration for CMP processing.

Key Capabilities

• Performs chemical mechanical planarization of wafers
• Supports semi-automatic operation for process steps

Key Specifications

| Parameter | Value | Unit |