F&K Delvotec

Company Description

F&K Delvotec Bondtechnik GmbH is a technology leader in innovative joining technology founded in 1978 and headquartered in Ottobrunn, Germany, specializing in ultrasonic and laser wire bonding systems for the semiconductor, electronics, and battery industries. The company has established itself as an innovation leader through extensive research and development activities, particularly in the fields of ultrasonic bonders and laser microwelding technology for power electronics applications and battery module assembly.

Company Details

• Year Founded: 1978
• Headquarters: Ottobrunn, Bavaria, Germany
• Manufacturing Locations:
  • Germany: Ottobrunn (Main facility)
  • USA: Foothill Ranch, California
  • Singapore: Singapore Science Park II
  • China: Shanghai and Taicang
• Annual Revenue: $9.6M (2024)
• Employee Count: 48 (majority engineers)
• Global Presence:
  • Technical Support: USA, China, Singapore
  • Sales: Worldwide network
  • Service Centers: Europe, North America, Asia

Company Overview

• Production Capacity
  • Specialized manufacturing of bonding equipment
  • Custom automation solutions
  • Process development capabilities
• Equipment Specifications
  • Laser Bonder M17LSB XL
    • Working range: 100mm in Z-axis
    • Focus consistency: Within a few microns
    • Suitable for aluminum, copper, and nickel ribbons
    • Welding depth penetration: 6-8µm
  • Ultrasonic Wire Bonder
    • Positioning accuracy: Micron level precision
    • Wire diameter range: 17.5µm to 600µm+
    • Ribbon bonding capacity: For high current applications
  • Precision Quality
    • Bond Process Control: Real-time monitoring of bonding quality
    • In-head pull testing for non-destructive quality assurance
• R&D Facilities
  • Collaborative research with Fraunhofer Institute for Laser Technology
  • Development focus on battery module bonding solutions
  • Participation in government-funded research projects

Certifications & Compliance

• Market Listings: Part of Strama Group
• Patent/IP Information: Over 30 patents in wire bonding technology
• Industry-Specific Compliance: Collaborations with German research institutes

Equipment Portfolio

• Laser Bonder
  • Application: Battery module connections, power electronics
  • Capability: Joining wire/ribbon onto battery terminals, DCB substrates, copper terminals
  • Advantage: Higher current capacity than traditional wire bonding
• Ultrasonic Wire Bonder
  • Application: Semiconductor interconnects, battery management systems
  • Range: Fine wire, heavy wire, and ribbon bonding in a single machine
  • Markets: Automotive, sensor technology, power electronics
• Specialized Battery Equipment
  • Laser microwelding for Battery Management Systems (BMS)
  • Flexible PCB connections for high-volume production
  • Large work area for battery module assembly