F&K DELVOTEC M17LSB Laser Bonder combines precision laser welding with wire bonding technology for advanced microelectronics manufacturing, power modules, and battery assembly applications where conventional ultrasonic bonding reaches its technological limits.

Key Features

• Dual-process capability combining laser welding and wire bonding technologies in a single machine without conversion
• Low bonding force system using laser energy to weld aluminum, copper, or nickel ribbons with minimal surface quality requirements
• Advanced touch-down sensor system with image recognition allowing for XYZ position tolerances compared to conventional laser welding
• Large work envelope supporting components up to 300 x 300 mm for diverse production requirements
• Adjustable pulse energy and duration with high-precision microsecond control for optimized welding performance
• Automated fiducial recognition and calibration for rapid setup and consistent production quality
• Greater current-carrying capacity due to larger conductor cross-sections than possible with ultrasonic bonding
• Proven performance across multiple applications including power modules, battery assembly, OPTO/RF/HF components, BMS systems, PCB manufacturing, and automotive cell production
• Battery applications: Terminal tab welding, battery pack interconnects, busbar connections

System is engineered for seamless integration into both research and production environments, with comprehensive documentation available for implementation planning.

Additional Documentation (NDA Required)

• Detailed Technical Specifications
• Process Parameter Guidelines
• Integration Requirements

Key Technical Specifications